This paper discusses the evolution of both conventional and advanced packaging technologies and outlines future directions for design, fabrication, and packaging using glass substrates and femtosecond laser processing. IntroductionOptical communication today is highly dependent on photonic chips and optical modules, serving as the underpinning components in data centers, cloud computing, AI, and 5G. Introduction The challenges in modern HPC, AI, and data communication systems. Its core concept is to remove digital processing units such as DSPs and CDRs from the module, constructing a purely analog "linear direct-drive" optical link. In the LPO architecture: The transmitter uses a high-linearity driver chip to directly drive the optical modulator, converting the. PCI-SIG Optical WG baseline proposal for ECN to PCIe Base Specification Rev6., ECN will focus on updates to section 4.