The greatest value from doing business with JCET is realized when engaging JCET as a full turnkey solutions provider – including IC design and characterization, wafer bumping, packaging, test, and shipment to end customers. Shanghai, China, January 21, 2026 — JCET Group today announced a key milestone in co-packaged optics (CPO). The company has delivered customer samples of its silicon photonics engine developed on the XDFOI ® advanced packaging platform. JCET Group primarily serves sectors such as mobile, communication, compute, consumer, automotive, and industrial. ) was founded in November 1998 and listed on the main board of the Shanghai Stock Exchange in 2003. 275 Binjiang Middle Road, Jiangyin City, Jiangsu Province, it is a globally leading. A leading global provider of semiconductor system integration packaging and testing services, specializing in the manufacturing of semiconductor devices and similar components. Ranked as the third-largest Outsourced Semiconductor Assembly and Test (OSAT) company worldwide.
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