Optical Integrated Sensing and Communication
In this article, we first introduce the generalized system structure of O-ISAC, and then elaborate on three advantages of O-ISAC, i.e., increasing communication rate, enhancing sensing precision, and
Accordingly, this Special Issue aims to present research papers, communications, and review articles focusing on heterogeneous multi-dimensional fusion integration, optoelectronic fusion collaborative...
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In this article, we first introduce the generalized system structure of O-ISAC, and then elaborate on three advantages of O-ISAC, i.e., increasing communication rate, enhancing sensing precision, and
In this work, we propose an optoelectronic integrated sensing and communication system based on InGaN/GaN MQW integrated transceiver chip for wireless air pressure detection.
Recent years have seen remarkable progress in three-dimensional (3D) integration of non-silicon materials, enabling the convergence of diverse
This broadband sensitivity enables novel functionalities, including thermal and chemical signature detection, in a compact, chip-integrated format. Such spectral versatility is critical for
Integrated sensing and communication (ISAC) technology enables simultaneous sensing and communication functions through shared hardware and resources tailored to specific applications.
Herein, a GaN optoelectronic integrated chip with multifunctions of communication, sensing, and neuromorphic computing is proposed and fabricated on a GaN-on-Si light-emitting
It will allow for the multi-functional integration of communications, sensing, and computing chips, as well as optoelectronic intelligent chips, promoting innovation in ultra-broadband optical networks, satellite
To meet this need, we demonstrate a solution-processed optoelectronic fusion-upconversion device (OEF-UCD) that seamlessly integrates near-infrared detection with visible emission.
Based on an advanced thin-film lithium niobate photonics platform, they successfully developed an ultrabroadband optoelectronic integrated chip that enables adaptive, reconfigurable, and...
In this article, we first introduce the generalized system structure of O-ISAC, and then elaborate on three advantages of O-ISAC, i.e., increasing communication rate, enhancing sensing
Recent years have seen remarkable progress in three-dimensional (3D) integration of non-silicon materials, enabling the convergence of diverse functionalities such as sensing, storage,